Milestones

No. Elapsed time from start (in months) of the project Milestone Deliverables
  1.  

3 months

Team Development/Hiring

Completion of Literature Review

CAD Tool Acquisition

PCs Procurement and Research Lab Setup

NDA signing / PDK Acquisition

  • Profile of the required/developed team and hiring process details, criteria, JDs, CVs of hired candidates.
  • Procurement Plan for the CAD Tools and Lab Equipment.
  • Detailed Literature Review report stating:
  • selected design approaches with proper motivations behind them
  • packaging requirements and challenges for the System-in-Package (SiP).
  • Details pertaining to lab along with complete specifications.
  • Status report pertaining to Lab Set-up
  • NDA with the selected FAB.
  • Detailed international and national travel plan along with tentative dates.
  1.  

6 months

Completion of Model development for structures, chemical and pathogens under consideration to spec-out the sensor Microsystems

Completion of Lab Equipment Procurement

Preliminary development of microsensors mechanical, optoelectrical and chemical counterparts

  • A comprehensive report on all equipment to be procure  and that have been already procured including software licenses.
  • Specification document for each sensor Microsystem
  • Microsensors preliminary development progress report
  • Demonstration of the CAD tools to the National ICT R&D Fund
  1.  

9 months

Completion of first intermediate stage of microsensors mechanical, optoelectrical and chemical counterparts development

  • Status / Progress report on microsensors development
  1.  

12 months

Completion of second intermediate stage of microsensors mechanical, optoelectrical and chemical counterparts development

In parallel, first intermediate design of readout interfaces (ROI) for microsensors would be completed

  • Status / Progress report on microsensors and readout interface (ROI) development
  • Demonstration of designed microsensors in CAD tools to National ICT R&D Fund
  • Intermediate design report of readout interfaces (ROI) for microsensors
  1.  

15 months

Completion of microsensors mechanical, optoelectrical and chemical counterparts development

In parallel, second intermediate design of ROIs for microsensors would be completed

  • Status / Progress report on microsensors and readout interface development.
  1.  

18 months

Completion of ROIs for the Microsystems

  • A comprehensive design report pertaining to the CMOS Readout Interface (ROI) 
  • Preliminary Conference Publications to relatively lighter conference that accept intermediate results (especially from the perspective of students):
    • IEEE PRIME Conference
    • IEEE INMIC Conference
    • Local Conferences such as IBCAST etc.
  1.  

21 months

Integration of the Microsystems and Tape-out of the first Prototype ASIC1

  • GDS file of the complete integrated Microsystem
  • A detailed report on Integration of the Microsystems and Tape-out of the first Prototype ASIC1
  • Demonstration of the integrated ASIC in the CAD tools to the National ICT R&D Fund
  • Marketing/Outreach Plan
  1.  

24 months

Completion of the Test board and Test setup for the in-lab testing of the Microsystem

  • PCB Gerber files and test plan document
  • A detailed report on the completion of the Test board and Test setup for the in-lab testing of the Microsystem
  1.  

27 months

Preliminary in-vitro testing of ASIC1

  • Testing results/progress document
  • Conference Publications to the selected conferences (but not limited to the following):
    • IEEE ESSCIRC conference
    • IEEE ISCAS conference
    • DAC conference
  1.  

30 months

Completion of in-vitro testing and design enhancements based on testing results

OR

Re-spin/Tape-out of ASIC1 as ASIC2 in case of fatal failure in ASIC1

 

  • A comprehensive report on complete test results along with type of tests conducted. In case of any bugs fixes, an updated report should also be submitted clearly indicating the enhancements / improvements in the existing system.
  • GDS File of ASIC2 if re-spin was performed.
  • Filing of national/international patents
    • Documentary evidence /Proof of initiation of application filing for national & international patents
  • Publication of the Measured Results and Design Details to selected Integrated Circuits Journals such as (but not limited to) , IC journals do not accept publication without measurement results:
    • IEEE Journal of Solid-State Circuits
    • IEEE Transactions on Circuits and Systems I/II
    • IEEE Journal of Biomedical Electronics
    • Springer Journal of Analog Integrated Circuits and Processing
    • Elsevier Journal of Microelectronics
    • Wiley Journal of Circuit Theory and Applications
  1.  

33 months

Field Testing of ASIC1 if no fatal errors founds

OR

Test Setup and Test Board for ASIC2

  • Field Testing Preliminary Report showing the test results along with type of tests conducted. In case of any bugs fixes, an updated report should also be submitted clearly indicating the enhancements / improvements in the existing system.
  • PCB Gerber files and test plan document if re-spin was performed.
  • Team development/training completion of skilled IC designers under a research lab umbrella
  1.  

36 months

Completion of ASIC Field Testing

OR

In-Vitro Testing of ASIC2

  • Complete Design and Testing Document of ASIC1 as part of the final project report.
  • Complete Design and Testing Document of ASIC2 if re-spin was performed as part of the final project report.
  • A fully functional multi-purpose prototype Application-Specific IC (ASIC) prototype, containing the monolithically integrated multi-sensor Microsystem.
  • A complete library of different functional blocks of the Microsystems, Accelerometers, Bio-MEMS, Microbolometers, Microcantilever based Chemical sensors and their associated readout electronics in modular form such as pre-amplifiers, data-converters, filters, buffers, bias circuits should be indicated in the “Deliverables” section
  • Demo of the ASIC to the National ICTR&D Fund